HP
Code: HP2-T28
Exam Name: HP BladeSystem Administration
Question: 1
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What is a requirement for double-chip sparing on HP Integrity blades?
A. Proactive memory scrubbing
B. CPUs installed in pairs
C. 4 DIMMs, 4 GB or larger
D. 8 DIMMs, 2 GB or smaller
Answer: A
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Explanation: Reference:
https://h10139.www1.hp.com/h41111/rfg_formprocessor/hp_ess_ngmc/es/es/pdf/4AA2-0982ENW_RAS%20Features.pdf (page 4, double-chip memory sparing)x
Question: 2
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Place the marker at the location to insert the power cord for the power supply in bay 1.
Answer:
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Question: 3
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A customer has an HP BladeSystem c7000 enclosure with four power supplies. The power supplies are in bays 1, 2, 3, and 4. The customer wants to configure the enclosure to have AC redundant power while minimizing costs. What should the customer do?
A. Move the power supply from bay 1 to bay 5.
B. Move the power supply from bay 3 to bay 5.
C. Insert a new power supply in bay 5.
D. Insert a new power supply in bay 6.
Answer: C
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Question: 4
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What are the three bit settings on interconnects for Thermal Logic management on the HP BladeSystem C7000 enclosure? (Select three.)
A. Warm
B. Good
C. Alert
D. Cool
E. Hot
F. Critical
Answer: C, D, E
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Question: 5
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Where are the Service Pack for ProLiant (SPP) Hot Fixes and Customer Advisories available online? (Select two.)
A. SPP Blades subset version page
B. SPP Information Library
C. SPP fully bootable ISO
D. SPP Release Archive page
E. SPP download web page
Answer: A, E
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Explanation: Reference:
http://h18004.www1.hp.com/products/servers/service_packs/en/ca.2013.09.0(B).html
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